Board: (2L)
Base material: FR4
Surface treatment: Hallead free+resinplug-hole
Copper thickness: 2OZ
Board: (4L)
Base material: FR4(halogen-free)
Surface treatment: Immersion gold+resin plug-hole
Circuit width/circuit space: 3.5mil/3.5mil
Impedance requirement: Yes
Board: (6L) Base material: FR4 Surface treatment: Immersion gold+Blind ＆ Burued Vias Impedance requirement: Yes
Board: (2L) Basematerial: FR5 Surfacetreatment: Immersion gold Specialprocess: Bonding Aplate+Bplate into Cplate
