2L Board

Number of floors: 2;
Board thickness: 1.6mm;
Substrate material: FR4;
Surface treatment: lead-free spray tin

2L Board

Number of floors: 2;
Board thickness: 2.0mm;
Substrate material: FR4;
Surface treatment: spray tin

8L

Board thickness: 1.0mm;
Substrate material: FR4TG170;
Surface treatment: flashgold + hardgold (Au15U)

Fiber Board

Number of floors: 4;
Board thickness: 1.0mm;
Substrate material: FR4;
Surface treatment: Immersion gold + electric thick gold (Au30U)

4L Fiber Connector

Number of floors: 4;
Board thickness: 1.0mm;
Substrate material: FR4;
Surface treatment: Immersion gold + electric thick gold (Au15U)

6L Fiber Board With Immersion Gold

Number of floors: 6;
Board thickness: 1.0mm;
Substrate material: FR4;
Surface treatment: Immersion gold + electric thick gold (Au30U)

4L Board For Camera Hang Group

Layer count: 4
Board thinkness: 1.6mm
Laminate: FR4
Surface treatment: immersion gold (Au4U)

4L Printer Bonding Board

Number of floors: 4;
Board thickness: 1.0mm;
Surface treatment: Shen Jin (Au6U)

2L Printer Bonding Board

Number of floors: 2;
Board thickness: 1.6mm;
Basic materials: FR4;
Surface treatment: Shen Jin (Au4U)

Heavy Copper Board

Board: (2L)
Base material: FR4(tg170)
Board thickness: 2.1mm
Surface treatment: Halleadfree
Copper thickness: 4OZ

Heavy Copper Board

Board: (2L)
Base material: FR4
Board thickness: 2.1mm
Surface treatment: OSP
Copper thickness: 10OZ

2L Board

Board: (2L)
Base material: FR4
Board thickness: 0.2mm+/-0.05mm
Surface treatment: Immersiongold
Copper thickness: 1OZ