Board: (2L)
Base material: FR4(tg170)
Board thickness: 2.1mm
Surface treatment: Halleadfree
Copper thickness: 4OZ
Board: (2L)
Base material: FR4
Board thickness: 2.1mm
Surface treatment: OSP
Copper thickness: 10OZ
Board: (2L)
Base material: FR4
Board thickness: 0.2mm+/-0.05mm
Surface treatment: Immersiongold
Copper thickness: 1OZ
Board: (2L)
Base material: FR4
Surface treatment: Hallead free+resinplug-hole
Copper thickness: 2OZ
Board: (4L)
Base material: FR4(halogen-free)
Surface treatment: Immersion gold+resin plug-hole
Circuit width/circuit space: 3.5mil/3.5mil
Impedance requirement: Yes
Board: (6L)
Base material: FR4
Surface treatment: Immersion gold+Blind ＆ Burued Vias
Impedance requirement: Yes
Board: (2L)
Basematerial: FR5
Surfacetreatment: Immersion gold
Specialprocess: Bonding Aplate+Bplate into Cplate
