Manufacturing Capacity
| Item | Production Capacity | Model Production Capacity |
|---|---|---|
| Item | Production Capacity | Model Production Capacity |
| Board size | 20"x40" | 20"x40" |
| The highest level | 16 | 20 |
| Thickness | 0.3mm--5.0mm | 0.2mm--6.0mm |
| The smallest product aperture | 0.2mm | 0.15mm |
| Thickness ratio | 8:1 | 10:1 |
| Line width / Line gap（Outer) | 3.0mil/3.0mil 3.0mil/2.6mil |
2.5mil/2.5mil 2.5mil/2.5mil |
| Impedance control | +(-)10% | +(-)5% |
| Bottom copper thickness： Inside and outside | 10 OZ / 10 OZ | 10 OZ / 10 OZ |
| Electroplating thick gold | Au 0.8 - 60U" Ni50-200U" |
Au 0.8 - 60U" Ni 50-300U" |
| Chemical gold | Au 0.8 - 10U" Ni 50-200U" |
Au 0.8 - 10U" Ni 100-300U" |
| Green oil thickness | 0.2mil --1.2mil | 0.2mil --1.2mil |
| Blue glue thickness | 4mil / 20mil | 4mil / 20mil |